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Chip Scale Package LED Industry is Expected to reach a Valuation of US$ 5.8 billion by 2032

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Chip Scale Package LED Industry is Expected to reach a Valuation of US$ 5.8 billion by 2032

By 2032, the market for chip scale package LEDs is expected to be worth US$ 5.8 billion. In 2022, it was US$ 1.5 billion. The global market is anticipated to expand at a CAGR of 14.9% between 2022 and 2032. A chip scale package is an integrated circuit that can be surface mounted. Its surface area is 1.2 times no more than that of the original die.

The basis for this description of chip-scale packaging is the IPC/JEDEC J-STD-012. Chip-scale packaging has been one of the most significant advancements in the electronics industry since its introduction because of its several benefits.

Numerous conventional LEDs are made by using a chip fabrication process. The component is attached to the die, such as a package LED embedded in a ceramic substrate. A packed LED references the entire process. The two most crucial elements in chip-scale LED production are the manufacturing process and costs.

Chip-scale LEDs can be produced quickly and can often skip the manufacturing process. Chip-scale LEDs are thought to be the most well-liked trend in the market for chip-scale package LEDs. To be packed, a chip must adhere to a set of standards. In this case, the scale of packaged LED chips is appropriate for the plate, and their manufacturing is straightforward.

Market penetration for these chip scales is slower than it is for traditional packed LEDs. Yet in the next ten years, there would be a lot of room for chip scale.

The chip-size package LED sector will be in great demand owing to its superior qualities and cost savings. Chip scale is crucial for applications that use backlights.

The prospect of omitting essential packaging steps at a low cost could be a constraint on the worldwide market. The packaging or bill material for the product is relatively low-cost.

Key Takeaways

  • The global chip scale package LED market witnessed a CAGR of around 18.1% in the historical period.
  • The North American chip scale package LED market is likely to be about 23.2% in the forecast period.
  • The USA chip scale package LED market is expected to be worth US$ 780.4 million by 2032.
  • Japan’s chip scale package LED market is projected to be worth US$ 1.0 billion by 2032.
  • Based on the power range, the high-power segment is likely to witness a CAGR of 14.6% from 2022 to 2032.

“The main characteristics of chip scale package (CSP) LEDs are advantages over traditional LEDs. As a result, this industry draws in more end customers. Due to the product’s exceptional features, the distribution network will expand over the next 10 years. Numerous variables affect end customers buying these chip scales.” – Says a lead analyst.

Competitive Landscape:

There are several small- and medium-sized businesses operating in the global chip-scale package LED industry. Prominent players strive to spend on research & development projects in order to generate unique products. A few additional businesses are concentrating on releasing highly effective technologies to meet the growing demand.

For instance,

  • In July 2021, Osram introduced a new quantum dot LED named Osconiq E 2835 CRI 90. It will help to expand Osram’s portfolio of high-quality lighting solutions with an innovative mid-power LED.
  • In March 2021, Cree, Inc.’s business unit for Cree LED Products was fully acquired, according to SMART Global Holdings, Inc. The company’s expansion and diversification plan has reached a significant turning point with the completion of its purchase of Cree LED. The company’s other specialty businesses in memory and computing complement Cree LED’s focus on specialized illumination.
circuit

The American Printed Circuit Assembly Market Affected by Trade Wars but Resilient to the Pandemic

IndexBox has just published a new report: ‘U.S. Printed Circuit Assembly (Electronic Assembly) Market. Analysis And Forecast to 2025’. Here is a summary of the report’s key findings.

After two years of growth, the U.S. printed circuit assembly market decreased by -16.4% to $35.1B in 2019. The market value increased at an average annual rate of +2.9% over the period from 2013 to 2019; however, the trend pattern indicated some noticeable fluctuations being recorded throughout the analyzed period. Over the period under review, the market hit record highs at $41.9B in 2018, and then contracted markedly in the following year. This rapid decrease was caused b a plunge in printed circuit imports from China.

In terms of supplying countries, South Korea ($4.1B), Taiwan ($4.1B) and China ($3.4B) were the main suppliers of printed circuit assembly to the U.S., together accounting for 67% of total imports (IndexBox estimates). Imports from Taiwan recorded tangible growth in 2019, while supplies from China dropped dramatically in the last year. This went along a new round of trade confrontation between the U.S. and China when the U.S. tries to limit the influence of Chinese technology companies on the American market.

Printed circuit assembly production, meanwhile, amounted to $18.3B in 2019. The total output value increased at an average annual rate of +1.4% from 2013 to 2019. Despite the pandemic, preliminary data show that in the first half, cumulative revenues of electronic component manufacturers did not decline from the previous year. This could indicate that the printed circuit assemblies and microelectronics market, in general, will be more resilient to a pandemic than many other markets.

Printed circuit assemblies constitute integrated electronic systems containing various semiconductors and other elements mounted on printed circuit boards. Such systems are widely used in the production of electronic, computer, digital, video, audio and other types of apparatus, in the aerospace, industrial automation, telecommunications and many other areas.

Therefore, the key factor determining the development of the printed circuit assembly market is the dynamics of industrial manufacturing, which, in turn, depends on economic growth, employment and income of the population, and investments, which altogether reflect the overall GDP growth. In addition, the growth of the market is also shaped by the growing digitalization of the economy, the development of smart technology and the Internet of Things, as well as the rapid development of mobile communication networks and the expansion of their coverage.

According to the World Bank outlook from January 2020, the U.S. economy was expected to slow down to +1.7% per year in the medium term, hampered by increasing global uncertainty, the U.S.-China trade war, and slower global growth.

In early 2020, however, the global economy entered a period of the crisis caused by the COVID-19 epidemic, due to which most countries in the world put on halt production and transport activity. The result will be a drop in GDP relative to previous years and an unprecedented decline in oil prices.

The U.S. is struggling with a drastic short-term recession, with the expected contraction of GDP of approx. -6.1% in 2020, as the hit of the pandemic was harder than expected, and unemployment soared due to the shutdown and social isolation. The combination of tight financial conditions and uncertainty regarding the length of the pandemic and the possible bottom of the related economic drop, as well as high volatility of financial markets, disrupt capital investments in the immediate term, which may put a drag on the expansion of the printed circuit assembly market.

An additional serious risk for the medium-term recovery is the growth of geopolitical tensions in the world, especially between the United States and China, which are being drawn into a political confrontation on a wide range of issues. If sanctions and restrictions are tightened, it will hit global trade and worsen economic growth both in the United States and China and in many other countries involved in supply chains.

In addition to the development of electronics and the Internet of Things, the pandemic has triggered a surge in demand for mobile audio and video services, which will continue in the medium term. In addition, in the coming years, the active proliferation of 5G networks is expected to continue, which will give a new powerful impetus to the use of the Internet and the further development of smart devices. All of this will drive demand for printed circuit assemblies as they are key components of electronic engineering.

Taking into account the above, it is expected that in the medium term, as the economy recovers from the effects of the pandemic, the market is expected to grow gradually. Overall, market performance is forecast to expand with an anticipated CAGR of +0.9% for the period from 2019 to 2030, which is projected to bring the market volume to 374M units (or $38B) by the end of 2030.

Companies Mentioned in the Report

Sanmina Corporation, Jabil Circuit, Xilinx, Flextronics International USA, Electronic Assembly Corporation, Mercury Systems, Ttm Technologies, Benchmark Electronics, Jabil Circuit, IEC Electronics Corp., Sypris Solutions, Flextronics America, Plexus Corp., M C Test Service, Express Manufacturing, American Technical Ceramics Corp, Sigmatron International, Magna Electronics, Park Electrochemical Corp., Creation Technologies Wisconsin, Diamond Multimedia Systems, Viasystems Technologies Corp, Mid-South Industries, Hadco Corporation, Kimball Electronics, Smtc Manufacturing Corporation of California, Flextronics Holding USA, Logic Pd, Viasystems

Source: IndexBox AI Platform

Semiconductor Manufacturing

Semiconductor Manufacturing Equipment Market is Projected to Reach USD 80 billion by 2026

According to a recent study from market research firm Global Market Insights, The adoption of technologies like AI and IoT in fabrication will significantly impact the semiconductor manufacturing equipment market forecast. Software companies are keen on implementing advanced solutions to cater to the rising demands of compact chipsets and growing production.

For instance, TCS in May 2020, developed an AI and cloud-based solution to detect errors in wafers besides improving the production and quality of semiconductors. Constant use of advanced chipsets in automotive and consumer electronics to offer advanced infrastructure and technical expertise have bolstered growth opportunities in OSAT companies. Reportedly, the global semiconductor manufacturing equipment market could reach an annual valuation of over USD 80 billion by 2026.

Based on dimensions, the semiconductor manufacturing equipment market, from the 2D segment, is believed to register a CAGR of 6% up to 2026 owing to its lower initial cost of architecture. The 2.5D technological framework is mainly deployed across high-performance computing devices as it offers high chip functionality. It is additionally used in front-end equipment and graphene electronics to attain cost efficiency in production.

Foundries brought in more than 25% of the annual revenues in 2019, pegged to rise at a CAGR of 4% over the coming years. A surge in the demand for power electronics and cryptocurrency has urged foundry suppliers to upgrade their IC production with newer nodes. For instance, Apple received a 5nm chipset from TSMC to integrate the A14 SoC into iPhone12, in April 2020. The continuous decline in the node size has elevated the requirements for new semiconductor manufacturing equipment in foundries.

The ongoing COVID-19 pandemic has affected the production activities of semiconductor components and chips among facilities and fabrication plants, hampering the semiconductor manufacturing equipment market outlook slightly. There is a lot of complexity associated with patterns in the chipsets as they require high accuracy in transferring data to chips and ICs. Undetected electrostatic discharge damages and particle contamination in the chips will lead to higher investments.

Various business strategies are being developed by major brands to enhance silicon wafer production. STMicroelectronics acquired Norstel AB, a Sweden-based Silicon Carbide wafer manufacturer, to boost the supply of wafers for diode and MOSFET used in industrial and automotive sectors.

In the lithography process in the front-end segment, various technical advancements will increase the need for semiconductor manufacturing devices in the next few years. For instance, EV Group launched the next generation lithography process “MLE” (Maskless Exposure) equipment for high-density PCB, MEMS, and biomedical applications.

The wafer manufacturing equipment segment recorded over 15% of the global market in 2019. It is likely to garner a CAGR of 5% in the next few years due to the growing consumption of silicon wafers. There is a higher requirement for wafer manufacturing equipment in fab facilities. As per the Semiconductor Equipment and Materials International (SEMI), global shipments for silicon wafers incremented by nearly 2.7% in terms of square inches in the first quarter of 2020 compared to the last quarter.

North America’s semiconductor manufacturing equipment market crossed over 10% of the global share in 2019. The government-imposed restrictions on the export of semiconductor chipsets from China and external chipmakers due to the ongoing trade war between the U.S. and China, influencing higher manufacturing in the North America region. Consistent technological developments in the telecom sector and augmented need for portable and smart electronic devices have resulted in increased investments in the semiconductor industries.

The Semiconductor Industry Association (SIA) invested more than USD 10 billion to expedite the production of semiconductors together with driving R&D initiatives in chip technology. Semiconductor manufacturing equipment companies are incorporating business strategies and planning product launches to deliver advanced products.

Key Companies covered in semiconductor manufacturing equipment market are ADVANTEST CORPORATION, Applied Materials, Inc, ASML, Cohu, Inc, EV Group (EVG), Hitachi High-Tech Corporation, KLA Corporation, LAM RESEARCH CORPORATION, Modutek Corporation, Nordson Corporation, Onto Innovation, Plasma-Therm, SCREEN Semiconductor Solutions Co., Ltd, Tokyo Electron Limited, Veeco Instruments Inc.

Source: https://www.gminsights.com/pressrelease/semiconductor-manufacturing-equipment-market