Ingram Micro Partners with Kyocera in Latin America - Global Trade Magazine
  November 5th, 2014 | Written by

Ingram Micro Partners with Kyocera in Latin America

San Diego, CA – California-based Ingram Micro Inc. and Japan’s Kyocera Communications Inc. have inked a new agreement in which Ingram Micro Mobility will be the distributor of Kyocera mobile phones in the Latin America region.

The new Kyocera DuraForce, an ultra-rugged, waterproof 4G LTE global-ready Android smartphone will be the first Kyocera product to enter the Latin America region via this relationship.

Kyocera “will leverage Ingram Micro’s extensive infrastructure and unique channel capabilities in Latin America, reaching 25,000 value-added resellers (VARs), system integrators and service providers,” according to a joint statement.

DuraForce, recently announced in the U.S. market with AT&T, is the newest device in Kyocera’s rugged smartphone portfolio and underscores Kyocera’s strength in the rugged, waterproof smartphone space.

The Military Standard 810G- and IP68-certified device enables active consumers and workers to use their smartphones more effectively “whether connecting with the corporate office from a construction jobsite or accessing vital medical data to support prescription authorizations in healthcare settings.”

Additionally, DuraForce supports various Push-to-Talk (PTT) services and platforms, and for the non-PTT user, the dedicated button can be reprogrammed for other preferred features or applications.

“Ingram Micro Mobility offers the experience, infrastructure and extensive network of VARs necessary to successfully launch and support Kyocera mobile devices across Latin America,” said Eric Anderson, senior vice president and general manager of global sales and marketing at Kyocera Communications.

“This relationship enables us to provide new handsets like DuraForce and support future devices in more than 40 countries in the region, allowing businesses to realize increased productivity and lower their total cost of ownership through durable devices that will stand up to the toughest environments.”

11/05/2014


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